Reed Smith announced Evan Kelson has joined the firm’s Financial Industry Group in New York, adding significant depth to its asset finance, receivables financing and securitization capabilities. Kelson joins Reed Smith from Chapman and Cutler LLP.
A seasoned attorney with a deep practice that spans finance, corporate, and securities laws, Kelson also advises clients on matters pertaining to trade finance, factoring, receivables sale financings, bond offerings, capital market transactions, trade and supply chain finance, and structured capital transactions. He also has extensive experience representing financial institutions on a wide range of structured finance transactions and syndicated credit facilities. Additionally, Kelson also has significant experience in equipment finance, an area of increasing focus for many of the firm’s banking clients globally.
In the equipment finance space, Kelson represents financial institutions in various forms of financings, including warehouse financings, private placements of equipment lease and loan-backed securities, as well as commercial paper conduit facilities. Evan also counsels various participants in the small-ticket, mid-ticket and large-ticket equipment finance sectors.
“Evan brings to the firm securitization, asset-based lending, and equipment finance capabilities that have been an area of specific need for us, based on client demand,” said Ed Estrada, Global Chair of Reed Smith’s Financial Industry Group. “Additionally, his broader finance acumen aligns well with several of our global practices, notably restructuring and our Transportation group. We welcome Evan to the firm and look forward to introducing him to our clients.”
Kelson’s clients include issuers, underwriters, sponsors, lenders, borrowers and investors in both private and public offerings and private placements of asset-backed securities in the term and commercial paper conduit markets.
Kelson received his J.D. from Brooklyn Law School (cum laude), and holds a B.A. from Binghamton University (magna cum laude).